Bid Tabulation Results for 2022 Chip Seal/Micro Paving Program
Dear Hopewell Township (Mercer),
This is a request for public records made under OPRA and the common law right of access. Please acknowledge receipt of this message.
Records requested:
Please send the final and compiled bid tabulation (Bid Tally), including all quantities and unit pricing for each bidder, for 2022 Chip Seal/Micro Paving Program that was submitted on 6/24/2022.
Below is an example of the format we are looking for that the engineer usually creates at the completion of the bid:
| | |
| BIDDER 1 | BIDDER 2 |
————————————————————————————————
Item | Description | QNT | UNIT | AMOUNT | UNIT | AMOUNT |
| | | | |
| | | | |
| | | | |
| | | | |
Please send all documents electronically.
Thanks,
PPA
Please be advised that I will be away from the office beginning Tuesday,
September 19, 2023 at 12:30 p.m. and will return on Thursday, September
28, 2023 at noon. I will have limited access to email. Please contact
the Deputy Clerk, Jessalyn Walters, at [email address] if you
need immediate assistance.
Please see the attachment regarding your OPRA request.
Jessalyn Walters, RMC
Deputy Municipal Clerk
Township of Hopewell
Office 609-537-0276
[1][email address]
[2]https://cdn.exclaimer.com/Handbook%20Ima...
[3]https://cdn.exclaimer.com/Handbook%20Ima...
[6]Logo1
[7]www.HopewellTwp.org
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From: Sean P. Canning <[email address]>
Sent: Tuesday, September 26, 2023 11:05 AM
To: Jessalyn Walters <[email address]>
Subject: RE: [EXTERNAL] OPRA request - Bid Tabulation Results for 2022
Chip Seal/Micro Paving Program
From: Jessalyn Walters <[8][email address]>
Sent: Tuesday, September 26, 2023 11:01 AM
To: Sean P. Canning <[9][email address]>
Subject: FW: [EXTERNAL] OPRA request - Bid Tabulation Results for 2022
Chip Seal/Micro Paving Program
Due October 5^th
From: Katherine Fenton-Newman <[10][Hopewell Township (Mercer) request email]>
Sent: Tuesday, September 26, 2023 10:56 AM
To: Jessalyn Walters <[11][email address]>
Subject: Fwd: [EXTERNAL] OPRA request - Bid Tabulation Results for 2022
Chip Seal/Micro Paving Program